Hole Drilling Machine – UV LASER
KOS-SF1000RBS SYTEM is ultra-precision capable of achieving a hole size of 50 μm or less in via hole processing.
Description
This product is a hole drilling system.
UV Laser has no difference in absorption for various materials such as polymide, copper, glass, and aramid.
It is possible to highly integrate the processing of blind via hole, buried via hole (IVH) and through via hole of PCB.
Specification:
