Glass Drilling Machine – Gantry System with IFOV and AI Alignment

Glass Drilling Machine – Gantry System with IFOV and AI Alignment

The system is a Glass Drilling facility that can process transparent materials such as quartz and glass up to 600mm x 600mm by implementing a Besel beam with IFOV (Infinite field of view) – 2D Galvo scanner – Linear Motion Stage synchronization, Axicon – Convex configuration.

Description

Application :

Transparent material(Quartz, Sapphire, Glass wafer ), TGV(Through Glass Via), TSV(Through Silicon Via)

Specification :

– Laser source :  355/532/1064nm (nano/pico/femto) can be selected

– Operation mode : IFOV (Infinite field of view) mode

– Scanner : 2D scanner

– Stage :  Stroke  ->  600 mm (X) x 600mm (Y) x 50mm (Z)
                 Accuracy  ->  ≤± 1.5 um
                 Repeatabilty  ->  ≤± 1 um
                 Straightness  ->  ≤± 5 um
                 Flatness  ->  ≤± 3 um

 – Size : 1800 mm x 1600 mm x 1650 mm  (Can be changed according to customer request)

 – Accesorries : Bessel beam delivery unit (Can be selected according to customer request)

Machine Demo :

 

 

Borosilicate Glass(Bessel beam), Wavelengh : 1030nm, Thickness : 1mm

 

Borosilicate Glass(Bessel beam), Wavelengh : 1030nm, Thickness : 1mm

 

Borosilicate Glass 3.3 (Dia 6″, Wafer), Wavelengh : 1030nm, Thickness : 1mm