AOPico Laser
- Molecular material processing
- precision processing of brittle materials
- transparent material processing
- PCB / FPC cutting and drilling, etc.
Description
Features & Benefits
· Disruptive cost-performance ratio
· All-in-one box design for easy integration
· POD & Burst Mode optional
· Excellent beam qualityof M <1.3
· Capable of 7/24 industrial production mode
Applications
· OLED/TFT-LCD all screen irregular cutting and drilling
· Semiconductor/PV Processing/Wafer Scribing
· Special Metal deep engraving and micro-structrue processing
· Medical device manufacturing
· Glass/Sapphire/Optical filter cutting and drilling
