μ LAB Basic
Micromachining System – Scanner mode
Application :
1. Small Area : under 180mm × 180mm
2. Wafer Cutting
3. ITO/FTO, Perovskite Composite (P1/P2/P3) Thin Metal Scribing / Patterning
4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam)
Description
– Laser wavelength: 355/532/1064 nm
– Scanner with Off-axis camera
– Image detection and monitoring
– Simultaneous quality inspection during processing
– Controllable illuminations for homogeneous intensity
