μ FAB_G_Dicing Machine

Description

Application : Si Wafer  Dicing, Metal wafer dicing etc.

Specification :

– Laser Source :  1070nm±10(fiber laser) 0.5~ 1 kW (Can be changed according to customer request)

– Laser Head : ≤ 4kw

– Stage : Stroke -> 600 mm (X) x 600mm (Y) x 100mm (Z) / Position  Accuracy  -> ≤ 0.05mm / Repeability ->≤ 0.01mm

– Sample size : ≤ 500X500mm (Can be changed according to customer request)

– Size : 1800 mm x 1600 mm x 1400 mm  (Can be changed according to customer request)

– Accesorries : Including item( Dust collector, Suction cup,  Inspection optic etc, (Can be selected according to customer request)