μ FAB_G_Dicing Machine
μ FAB_G_MOTF Machine – Gantry System with MOFT and AI Alignment
Description
Application : Si Wafer Dicing, Metal wafer dicing etc.
Specification :
– Laser Source : 1070nm±10(fiber laser) 0.5~ 1 kW (Can be changed according to customer request)
– Laser Head : ≤ 4kw
– Stage : Stroke -> 600 mm (X) x 600mm (Y) x 100mm (Z) / Position Accuracy -> ≤ 0.05mm / Repeability ->≤ 0.01mm
– Sample size : ≤ 500X500mm (Can be changed according to customer request)
– Size : 1800 mm x 1600 mm x 1400 mm (Can be changed according to customer request)
– Accesorries : Including item( Dust collector, Suction cup, Inspection optic etc, (Can be selected according to customer request)