μ FAB_G_IFOV Machine – Gantry System with IFOV and AI Alignment

μ FAB_G_IFOV Machine – Gantry System with IFOV and AI Alignment

Description

Application : Si/Glass Wafer, TGV, TSV, Interposer, Hole drilling, Si Stamping, Solar cell (Perovskite, CIGS )

Specification :

– Laser source :  1030nm(20W, 300fs-20ps), 532nm, 3 wavelength _selective

– Scanner : 2D scanner

– Stage :  Stroke  ->  600 mm (X) x 600mm (Y) x 50mm (Z)
                 Accuracy  ->  ≤± 1.5 um
                 Repeatabilty  ->  ≤± 1 um
                 Straightness  ->  ≤± 5 um
                 Flatness  ->  ≤± 3 um

 – Size : 1800 mm x 1600 mm x 1400 mm  (Can be changed according to customer request)

 – Accesorries : Including item( Dust collector, Suction cup,  Inspection optic etc, (Can be selected according to customer request)

 

Machine Demo :

AI Alignment Demo :

 

Laser Directing Writing Tool

 

Laser Alignment Tool (Machine Vision)