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- Micromachining Machine
- μ FAB Advance – Three Wavelength Laser Micromachining System – AI Alignment
- Micromachining System with Direct writing mode , Scanner mode and Machine Vision (Three wavelength) Applications : 1. Large Area Film( for ITO/FTO, Perovskite material) 2. Secondary Cell 3. OLED
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- Hole Drilling Machine
- Hole Drilling Machine – CO2 Laser with 3-Axis Scanner
- Most CO2 laser light is strongly absorbed by non-metallic materials. CO2 레이저의 빛은 대부분 비금속 물질에 강하게 흡수됩니다.
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- Hole Drilling Machine
- Hole Drilling Machine – UV LASER
- KOS-SF1000RBS SYTEM is ultra-precision capable of achieving a hole size of 50 μm or less in via hole processing. KOS-SF1000RBS SYTEM은 via hole가공에 있어 50μm이하의 hole size를 구현할 수 있는 초정밀
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