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- Laser Patterning System, Micromachining Machine
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- Micromachining System with Direct writing mode , Scanner mode and Machine Vision (Three wavelength) Applications : 1. Small Area : under 180mm × 180mm Large Area : under 600mm x 600mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) ,Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam Profile)
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- Laser Patterning System, Micromachining Machine
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- Micromachining System with Machine Vision Alignment Application : 1. Small Area : under 180mm × 180mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3), Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam, Top Hat Profile)
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- Laser Patterning System, Micromachining Machine
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- Micromachining System with Direct writing mode ,Machine Vision (1 wavelength) Application : 1. Small Area : under 180mm × 180mm Large Area : under 600mm x 600mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam, Top Hap Profile)
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- Laser Patterning System, Micromachining Machine
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- Micromachining System - Scanner mode Application : 1. Small Area : under 180mm × 180mm 2. Wafer Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam)
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