Laser Patterning System Archives - Kortherm Science

KORTherm Science Co., Ltd - Innovative Laser Technology +82-32-623-6320

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- Laser Micromachining Services, Laser Patterning System, Micromachining Machine
- Laser Scribing Machine for Perovskite Solar Cell (Sheet)
- Application : Mass Production 1. Size : under 300mm × 300 0mm 2. Cutting(Thin thickness), scribing for Transparent materials like Glass, Sapphire, Quartz 3. ITO/FTO, Thin Metal patterning
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- Laser Patterning System, Micromachining Machine
- μ FAB Advance – Three Wavelength Laser Micromachining System – AI Alignment
- Micromachining System with Direct writing mode , Scanner mode and Machine Vision (Three wavelength) Applications : 1. Small Area : under 180mm × 180mm Large Area : under 600mm x 600mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) ,Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam Profile)
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- Laser Patterning System, Micromachining Machine
- μ LAB Advance – AI Alignment
- Micromachining System with Machine Vision Alignment Application : 1. Small Area : under 180mm × 180mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3), Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam, Top Hat Profile)
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- Laser Patterning System, Micromachining Machine
- μ FAB Basic – AI Alignment
- Micromachining System with Direct writing mode ,Machine Vision (1 wavelength) Application : 1. Small Area : under 180mm × 180mm Large Area : under 600mm x 600mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam, Top Hap Profile)
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- Laser Patterning System, Micromachining Machine
- μ FAB_G_Dicing Machine
- μ FAB_G_MOTF Machine - Gantry System with MOFT and AI Alignment
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- Laser Patterning System, Micromachining Machine
- μ FAB_G_MOTF Machine – Gantry System with MOFT and AI Alignment
- μ FAB_G_MOTF Machine - Gantry System with MOFT and AI Alignment
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- Laser Patterning System
- μ FAB – CIS/CIGS – AI Alignment
- Application : CIS / CIGS
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- Hole Drilling Machine, Laser Patterning System, Micromachining Machine
- Hole Drilling Machine – UV LASER
- KOS-SF1000RBS SYTEM is ultra-precision capable of achieving a hole size of 50 μm or less in via hole processing.
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- Laser Patterning System, Micromachining Machine
- μ LAB Basic
- Micromachining System - Scanner mode Application : 1. Small Area : under 180mm × 180mm 2. Wafer Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam)
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- Laser Patterning System, Micromachining Machine
- Laser Doping Machine
- This is a technology that greatly reduces the cost of the process and increases the energy conversion efficiency.
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