Application : Mass Production 1. Size : under 300mm × 300 0mm 2. Cutting(Thin thickness), scribing for Transparent materials like Glass, Sapphire, Quartz 3. ITO/FTO, Thin Metal patterning
Micromachining System with Direct writing mode , Scanner mode and Machine Vision (Three wavelength) Applications : 1. Small Area : under 180mm × 180mm Large Area : under 600mm x 600mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) ,Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam Profile)
Micromachining System with Direct writing mode ,Machine Vision (1 wavelength) Application : 1. Small Area : under 180mm × 180mm Large Area : under 600mm x 600mm 2. Scribing / Patterning / Cutting 3. ITO/FTO, Perovskite Composite (P1/P2/P3) Thin Metal Scribing / Patterning 4. Si-Wafer, Polymer, Glass Cutting (Bessel Beam, Top Hap Profile)
