Application :
- Small Area : under 180mm × 180mm
- Wafer Cutting
- ITO/FTO, Thin Metal patterning
- Polymer
– Laser wavelength: 355/532/1064 nm
– Scanner with Off-axis camera
– Pattern recognition & alignment (Machine Vision)
– Image detection and monitoring
– Simultaneous quality inspection during processing
– Controllable illuminations for homogeneous intensity
AI Alignment
Off-axis Vision
Laser Alignment Tool (Machine Vision)
