μ FAB_G_Dicing Machine
Application : Si Stamping, Solar cell ( Perovskite, CIGS etc) for Large Aera.Specification :– Laser source : 1030nm(20W, 300fs-20ps), 532nm, 3 wavelength _selective– Scanner : 2D scanner– Stage : Stroke -> 600…
Application : Si Stamping, Solar cell ( Perovskite, CIGS etc) for Large Aera.Specification :– Laser source : 1030nm(20W, 300fs-20ps), 532nm, 3 wavelength _selective– Scanner : 2D scanner– Stage : Stroke -> 600…
Application : Si Stamping, Solar cell ( Perovskite, CIGS etc) for Large Aera. Specification : - Laser source : 1030nm(20W, 300fs-20ps), 532nm, 3 wavelength _selective - Scanner : 2D scanner…
Application : Mass Production 1. Size : under 300mm × 300 0mm 2. Cutting(Thin thickness), scribing for Transparent materials like Glass, Sapphire, Quartz 3. ITO/FTO, Thin Metal patterning – Laser wavelength: 355/532/1064 nm(Nano/Pico)…
Application : Flexible Film( for ITO/FTO, Perovskite material), Printed Electronics, PSC(Perovskite Solar Cell), OPVs(Organic Photovoltaics), CIGS, OLED, Touch Panel, etc Roll Width : ≤400mmMaterial : PETMaterial thickness : 100~ 188…
Application : CIS / CIGS Description This system is a device for pattern formation of thin-film solar cells using CIS / CIGS and silicon thin films, and uses ultra-short pulse…