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μ FAB_G_Dicing Machine

Application :  Si Stamping,  Solar cell ( Perovskite, CIGS etc) for Large Aera.

Specification :

– Laser source :  1030nm(20W, 300fs-20ps), 532nm, 3 wavelength _selective

– Scanner : 2D scanner

– Stage :  Stroke  ->  600 mm (X) x 600mm (Y) x 50mm (Z)
                 Accuracy  ->  ≤± 1.5 um
                 Repeatabilty  ->  ≤± 1 um
                 Straightness  ->  ≤± 5 um
                 Flatness  ->  ≤± 3 um

 – Size : 1800 mm x 1600 mm x 1400 mm  (Can be changed according to customer request)

 – Accesorries : Including item( Dust collector, Suction cup,  Inspection optic etc, (Can be selected according to customer request)

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